About the Cover Image for Computer Architecture and Organization: An Integrated Approach

The wafer scale integration theme on the cover of the book also appeared on the cover of Electronics magazine.

Integrated circuits (ICs) are grown on silicon wafers, and are visible as rectangular shaped regions in the image. ICs are diced up into individual “dies” which are packaged and placed on circuit boards. Wafer scale integration treats the wafer as the circuit board itself.